Home / Services / Waterless Liquid Cooling
Liquid coolingWaterless Liquid Cooling
Water-glycol loops were designed for chips around 600 W. At Blackwell-class power they boil inside the cold plate, and any leak is conductive. Our system replaces the water with a dielectric nanofluid, so a leak can't short the hardware, and pairs it with nano-coated cold plates and a short-loop CDU that fit existing racks without modifying the servers.
Why it's different
The specifics behind the claim.
Dielectric breakdown voltage
The coolant does not conduct electricity. A weeping fitting is a maintenance ticket, not a destroyed board.
Boiling point
No vapor lock at 1,000 to 2,000 W per chip. GPUs hold around 50 °C and run without thermal throttling.
PUE at the rack
About 30 percent less energy than air cooling, with no chillers or large pumping skids.
What is included
Scope is set per site. These are the building blocks we combine.
Nano-coated cold plates
A plasma-deposited interface layer bonds the thermal compound to the plate, cutting interface thermal resistance by 40 to 70 percent.
Short-loop CDU
A compact 6U to 10U unit with dual redundant variable-speed pumps that exchanges heat within two meters of the rack, in one stage.
Containerized 300 kW pods
A factory-built 20-foot unit with eight B300 racks plus cooling, power, fire suppression and monitoring, ready to set on a pad.
Waterless coolant vs. water-glycol (PG25)
| Water-glycol (PG25) | Waterless dielectric | |
|---|---|---|
| If it leaks | Conductive; can short GPUs and boards | Insulating; no short circuit |
| Chip power | Designed for about 600 W | 1,000–2,000 W and up |
| At high load | Vapor lock above ~45 °C in the plate; GPUs throttle past ~65 °C | Boils above 250 °C; chips held near 50 °C |
| Corrosion | Corrodes copper, scales, grows microbes | None; compatible with copper and aluminum |
| Fluid life | Replace every 2–3 years | 5–10 years |
How an engagement runs
Four stages. Each ends with something you can review before the next begins.
Survey
Rack power, chip type and existing loop, if any.
Design
Cold plates, CDU placement and redundancy.
Install
Fit plates and CDU, fill and pressure test.
Operate
Monitor temperatures and flow.